COOLING MODULE

• Main Authors: CHINUN LIAO, ALEX HORNG
• Format: Patent
• Language: Chinese; English
• Published: 30.10.2020
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

The present invention provides a heat dissipation module. The heat dissipation module is used for solving the problem that an existing heat dissipation module is poor in heat dissipation efficiency. The heat dissipation module comprises: at least one heat pipe, wherein a condensation section is arranged between the first end and the second end of the heat pipe, a first evaporation section is arranged between the first end and the condensation section of the heat pipe, a second evaporation section is arranged between the second end and the condensation section of the heat pipe, and the condensation section is communicated with the first evaporation section and the second evaporation section; and a radiating fin group which is positioned at the condensation section of the heat pipe. 一种散热模块，用以解决现有的散热模块的散热效率不佳问题，其包括：至少一个热管，该热管的第一端与第二端之间具有一个冷凝段，该热管的第一端与该冷凝段之间具有一个第一蒸发段，该热管的第二端与该冷凝段之间具有一个第二蒸发段，该冷凝段连通该第一蒸发段与该第二蒸发段；及一个散热鳍片组，位于该热管的冷凝段。