COB die bonding balance method and system, and COB die bonder

• Main Authors: LIU YAOJIN, ZENG YI
• Format: Patent
• Language: Chinese; English
• Published: 30.10.2020
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention provides a COB die bonding balance method and system, and a COB die bonder. According to the COB die bonding balance method, a die bonding head is controlled to extract wafers in a plurality of wafer discs, then the die bonding head is controlled to carry out die bonding on the extracted wafers on a substrate, and during die bonding, that wafers with different electrical parameters are fixed around each die bonding point is ensured. The COB die bonder is advantaged in that the COB die bonder adopts a COB die bonding balance method, when a large LED display screen is formed, no large color difference exists, the product quality is guaranteed, meanwhile, the technological process of suppliers is saved, and the revolutionary significance is achieved for industry development. 本发明提供了一种COB固晶平衡方法、系统及COB固晶机，在COB固晶平衡方法中，控制固晶头将多个晶圆盘中的晶圆进行提取，然后控制固晶头将提取的晶圆在基板上进行固晶，在固晶时，确保每一个固晶点周围固定不同电参数的晶圆。本发明的有益效果是：本发明的COB固晶机采用COB固晶平衡方法，当组成一个大的LED显示屏时不会有很大的色差，保证产品质量，同时节省了供应商的工艺流程，对行业发展具有革命性的意义。