Camera module, molded photosensitive component, manufacturing method thereof and electronic equipment

• Main Authors: XU CHENXIANG, XI FENGSHENG, YANG ZONGCHUN, HUANG ZHEN, LUAN ZHONGYU
• Format: Patent
• Language: Chinese; English
• Published: 23.10.2020
• Subjects: AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; ELECTRIC COMMUNICATION TECHNIQUE; ELECTRICITY; PERFORMING OPERATIONS; PICTORIAL COMMUNICATION, e.g. TELEVISION; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; TRANSPORTING; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

The invention discloses a camera module, a molded photosensitive component, a manufacturing method thereof and electronic equipment. The molded photosensitive component is used for being assembled with at least one optical lens to form the camera module. The molded photosensitive assembly includes an imaging assembly, a molded base, and a filter member. The molded base includes a first molded partand a second molded part. The first molded part wraps a part of the imaging assembly. The second molded part is integrally formed on the first upper surface of the first molded part; the second molded part is provided with a second upper surface and a second outer side surface; the filter member is attached to the second upper surface of the second molded part, and the filter member corresponds to a photosensitive path of the imaging assembly. The second upper surface of the second molded part is higher than the first upper surface of the first molded part, so that an outer space is defined by the second outer side s