Ceramic substrate through hole coating mechanism

• Main Authors: HUANG TINGJUN, CHEN JICHANG
• Format: Patent
• Language: Chinese; English
• Published: 23.10.2020
• Subjects: LINING MACHINES; PERFORMING OPERATIONS; PRINTING; PRINTING MACHINES OR PRESSES; STAMPS; TRANSPORTING; TYPEWRITERS

The invention discloses a ceramic substrate through hole coating mechanism. The ceramic substrate through hole coating mechanism comprises a machine base, a through hole jig arranged on the machine base and a steel screen positioning frame; the through hole jig is movably arranged below the steel screen positioning frame, a first conveying guide rail is arranged at the bottom of the through hole jig, the steel screen positioning frame is located on one side of the first conveying guide rail, the through hole jig is connected to the first conveying guide rail in a sliding mode, a ceramic substrate containing station is arranged on the through hole jig, a through hole needle block is movably arranged at the position, corresponding to a through hole of a ceramic substrate, of the bottom of the ceramic substrate containing station, the bottom of the through hole needle block is connected with a lifting rod, the shape of the through hole needle block corresponds to that of the through holeof the ceramic substrate,