Automatic polishing device

• Main Author: WANG ZHENGCAI
• Format: Patent
• Language: Chinese; English
• Published: 23.10.2020
• Subjects: DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; PERFORMING OPERATIONS; POLISHING; TRANSPORTING

The invention discloses an automatic polishing device. The automatic polishing device comprises a worktable, an ejection mechanism, a movable plate adjusting mechanism, a movable slag cleaning mechanism and a lifting adjusting mechanism; an assembly groove is formed in the inner part of the worktable; the ejection mechanism is arranged in the worktable; a main three-claw chuck is arranged on one end of the ejection mechanism; the movable slag cleaning mechanism is arranged on a movable plate; an assembly rack is arranged on the upper surface of the movable plate; a sub three-claw chuck is fixedly arranged on an operation end of a motor; the lifting adjusting mechanism is arranged on one side of the upper surface of the worktable; a polishing motor is arranged on the lifting adjusting mechanism; a polishing wheel is arranged on the polishing motor; the main three-claw chuck is arranged right below the polishing wheel; the corresponding three-claw chuck is selected for fixing according to the shape of a to-be-p