MOLDING PROCESSES FOR METALLIC FOAMS, APPARATUSES, AND PRODUCTS

Embodiments of the present technology include molding processes for metallic foams, apparatuses, and products. An example method includes placing an uncompressed charge of conductive metal foam into acavity disposed on a first tool, wherein the first tool is located on a first portion of a compressi...

Full description

Saved in:
Bibliographic Details
Main Authors FARQUHAR JAMES J, MCBRIDE DARRYL G
Format Patent
LanguageChinese
English
Published 20.10.2020
Subjects
Online AccessGet full text

Cover

Loading…
More Information
Summary:Embodiments of the present technology include molding processes for metallic foams, apparatuses, and products. An example method includes placing an uncompressed charge of conductive metal foam into acavity disposed on a first tool, wherein the first tool is located on a first portion of a compression mold apparatus, translating the first portion of the compression mold apparatus towards a secondportion of the compression mold apparatus so as to compress the uncompressed charge of conductive metal foam, creating a compressed charge of conductive metal foam, and overmolding around and throughthe compressed charge of conductive metal foam with an overmolding material. 本技术的实施方式包括用于金属泡沫的成型方法、设备和产品。一个示例方法包括将导电金属泡沫的未压缩进料放入设置在第一工具上的空腔中,其中第一工具位于压缩模具设备的第一部分上,将压缩模具设备的第一部分朝向压缩模具设备的第二部分平移,以便压缩导电金属泡沫的未压缩进料,产生导电金属泡沫的压缩进料,和用包覆成型材料围绕并通过导电金属泡沫的压缩进料进行包覆成型。
Bibliography:Application Number: CN201880087990