COMPONENT-MOUNTING DEVICE

• Main Authors: NIWA KOTA, KAMIO RYOHEI, SUGIHARA KOHEI, GOTO HIDENORI
• Format: Patent
• Language: Chinese; English
• Published: 16.10.2020
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

A component-mounting device makes it possible to mount, on a substrate, a component having a characteristic part on the upper surface thereof. This component-mounting device collects a component usinga collection member, and places the collected component on a temporary placement stage at an angle that, relative to the substrate, is substantially the same as a desired mounding angle. Next, the component-mounting device captures an image of the upper surface of the placed component using an upper imaging device, and re-collects the placed component. The component-mounting device then mounts the re-collected component at the desired mounting angle in the desired mounting position that is corrected on the basis of the amount of positional deviation in the characteristic part as recognized via an upper-surface image of the imaged upper surface. 元件安装装置能够向基板安装在上表面具有特征部的元件。该元件安装装置利用拾取构件来拾取元件，并将拾取到的元件以与向基板安装的目标安装角度大致相同的角度载置于临时载置台。接着，元件安装装置利用上方拍摄装置对所载置的元件的上表面进行拍摄，并再次拾取所载置的元件。并且，元件安装装置将再次拾取的元件以目标安装角度安装于基于通过拍摄到的上表面的上表面图