POLYISOBUTYLENE ADHESIVE COMPRISING POLYOLEFIN COPOLYMER ADDITIVE

• Main Authors: MCALLISTER JOHN W, JOHNSON JACOB P, CLAPPER JASON D, BIEBER PIERRE, EVERAERTS ALBERT I, CHEN ZHONG, SAHNI VASAV, AMOS DAVID T
• Format: Patent
• Language: Chinese; English
• Published: 16.10.2020
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; DYES; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; POLISHES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF MATERIALS AS ADHESIVES

An adhesive composition are articles are described. The adhesive composition comprises a polyisobutylene polymer component; up to 20 wt.-% of a polyolefin copolymer comprising polymerized units of anacidic monomer; and optionally, at least one tackifier. The polyolefin copolymer typically comprises C2-C4 alkylene units. The polyolefin copolymer comprises polymerized units of a carboxylic acid, orunsaturated derivative thereof. In some embodiments, the polyolefin copolymer has a melting temperature ranging from 50 to 150 DEG C. In some embodiments, the polyolefin copolymer has an acid numberof less than 40, 35, 30, or 25 mgKOH/g. 本发明描述了一种粘合剂组合物和制品。所述粘合剂组合物包含聚异丁烯聚合物组分；至多20重量％的聚烯烃共聚物，所述聚烯烃共聚物包含酸性单体的聚合单元；以及任选地，至少一种增粘剂。所述聚烯烃共聚物通常包含C2-C4烷亚基单元。所述聚烯烃共聚物包含羧酸或其不饱和衍生物的聚合单元。在一些实施方案中，所述聚烯烃共聚物具有在50℃至150℃范围内的熔融温度。在一些实施方案中，所述聚烯烃共聚物具有小于40mgKOH/g、35mgKOH/g、30mgKOH/g或25mgKOH/g的酸值。