ELECTRONIC PRINTED CIRCUIT BOARD ASSEMBLY FOR HIGH-POWER COMPONENTS

The invention relates to an electronic module (40) comprising at least one printed circuit board of a first type (referred to as 'printed circuit board A'), which is equipped in an overlapping mannerwith at least one printed circuit board of a second type (referred to as 'printed circ...

Full description

Saved in:
Bibliographic Details
Main Authors EDLINGER ERIK, LAHNER MARKUS, MANHART WOLFGANG, KIESLINGER DIETMAR
Format Patent
LanguageChinese
English
Published 13.10.2020
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
Online AccessGet full text

Cover

More Information
Summary:The invention relates to an electronic module (40) comprising at least one printed circuit board of a first type (referred to as 'printed circuit board A'), which is equipped in an overlapping mannerwith at least one printed circuit board of a second type (referred to as 'printed circuit board B'), printed circuit board B being equipped with at least one electronic component with specific requirements (19), and the interconnected printed circuit boards A and B forming a stepped composite printed circuit board (100, 200, 300, 400, 500). The composite printed circuit board (100, 200, 300, 400,500) is delimited at least in some regions by end regions (16) which are formed by sections of the at least one printed circuit board A, and the composite printed circuit board (100, 200, 300, 400, 500) is placed on a heat sink (20). A fastening side (15) of the at least one printed circuit board B rests flat on a contact face (21) of the heat sink (20), the contact face (21) of the heat sink (20)being dimensioned and posi
Bibliography:Application Number: CN201980015346