Interconnect structure with redundant electrical connectors and associated systems and methods

• Main Author: CHANDOLU ANILKUMAR
• Format: Patent
• Language: Chinese; English
• Published: 25.09.2020
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention relates to an interconnect structure with redundant electrical connectors and associated systems and methods. Semiconductor die assemblies having interconnect structures with redundant electrical connectors are disclosed herein. In one embodiment, a semiconductor die assembly includes a first semiconductor die, a second semiconductor die, and an interconnect structure between the first and the second semiconductor dies. The interconnect structure includes a first conductive film coupled to the first semiconductor die and a second conductive film coupled to the second semiconductor die. The interconnect structure further includes a plurality of redundant electrical connectors extending between the first and second conductive films and electrically coupled to one another via the first conductive film. 本发明涉及具有冗余电连接器的互连结构及相关系统与方法。本发明揭示具有含冗余电连接器的互连结构的半导体裸片组合件。在一个实施例中，半导体裸片组合件包含第一半导体裸片、第二半导体裸片及介于所述第一半导体裸片与所述第二半导体裸片之间的互连结构。所述互连结构包含耦合到所述第一半导体裸片的第一导电膜及耦合到所述第二半导体裸片的第二导电膜。所述互连结构进一步包含在所述第一导电膜与所述第二导电膜之间延伸且经由