SEMICONDUCTOR MODULE INCLUDING PRINTED CIRCUIT BOARD

• Main Authors: JIN HO BAE, YU JEONG CHOE, KYU YONG CHOI
• Format: Patent
• Language: Chinese; English
• Published: 22.09.2020
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

The present invention relates to a semiconductor module including a printed circuit board and a device. The device comprises: a substrate having a first surface and a second surface; a first conductive terminal disposed over the first surface; a second conductive terminal spaced apart from the first conductive terminal in a first direction and disposed over the first surface; a first conductive auxiliary pattern disposed below the first conductive terminal and overlapping with the first conductive terminal, the first conductive auxiliary pattern being coupled to the second conductive terminal;and a second conductive auxiliary pattern disposed below the second conductive terminal and overlapping with the second conducive terminal, the second conductive auxiliary pattern being coupled to the first conductive terminal. 本发明涉及一种包括印刷电路板的半导体模块以及一种装置，该装置可包括：具有第一表面和第二表面的衬底；设置在第一表面上方的第一导电端子；沿第一方向与第一导电端子间隔开并且设置在第一表面上方的第二导电端子；设置在第一导电端子下方并且与第一导电端子重叠的第一导电辅助图案，第一导电辅助图案联接到第二导电端子；以及设置在第二导电端子下方并且与第二导电端子重叠的第二导电辅助图案，第二导电辅助图案联接到第