SEMICONDUCTOR BACK SURFACE CONTACT FILM AND DICING TAPE-INTEGRATED SEMICONDUCTOR BACK SURFACE CONTACT FILM

• Main Authors: SATO SATOSHI, SHIGA GOSHI, TAKAMOTO NAOHIDE
• Format: Patent
• Language: Chinese; English
• Published: 11.09.2020
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; BASIC ELECTRIC ELEMENTS; CHEMISTRY; DYES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; PERFORMING OPERATIONS; POLISHES; SEMICONDUCTOR DEVICES; TRANSPORTING; USE OF MATERIALS AS ADHESIVES

Provided is a semiconductor back surface contact film capable of rendering wrinkling thereof difficult when peeled off from a separator. This semiconductor back surface contact film has a planar projection area of 22500 mm or more, and has a non-circular planar projection shape having at least one R-portion in which a curvature radius R1 is 0.5-10 mm. This dicing tape-integrated semiconductor back surface contact film includes: a dicing tape which has a laminated structure including a base material and an adhesive layer; and the semiconductor back surface contact film which is peelably in contact with the adhesive layer of the dicing tape, wherein the dicing tape has a planar projection area larger than the semiconductor back surface contact film and has a planar projection shape havingan arc portion. 提供可在自隔离体的剥离时不易产生褶皱的半导体背面密合薄膜。半导体背面密合薄膜的平面投影面积为22500mm以上，平面投影形状为具有至少1个曲率半径R1为0.5～10mm的圆弧部的非圆形状。一种切割带一体型半导体背面密合薄膜，其具备：切割带，所述切割带具有包含基材和粘合剂层的层叠结构；和前述半导体背面密合薄膜，其以可剥离的方式密合于前述切割带中的前述粘合剂层，前述切割带的平面投影面积比前述半导体背面密合薄膜大，并且平面投