PLATED LAYERED BODY FOR ELECTROMAGNETIC WAVE SHIELD, ELECTROMAGNETIC WAVE SHIELD MATERIAL, AND ELECTROMAGNETIC WAVE SHIELD MATERIAL MANUFACTURING METHOD

• Main Authors: ICHISHIMA MASASHI, HARADA SATOKO, YOSHIOKA KOH, SHIGYOU DAISUKE
• Format: Patent
• Language: Chinese; English
• Published: 11.09.2020
• Subjects: APPARATUS THEREFOR; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROFORMING; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; PERFORMING OPERATIONS; PRINTED CIRCUITS; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS; TRANSPORTING

Provided is a plated layered body for an electromagnetic wave shield, the plated layered body comprising a cobalt plating layer and a nickel plated layer that is formed over the cobalt plating layer,and being configured such that: the ratio (TNi / (TCo + TNi)) of the thickness TNi of the nickel plating layer to the total of the thickness TCo of the cobalt plating layer and the thickness TNi of the nickel plating layer is 0.2-0.9; and the crystal orientation index in the (220) plane at the outermost surface of the nickel plating layer is at least 0.8. 提供一种电磁波屏蔽用镀覆层叠体，其具备：镀钴层、和形成于前述镀钴层上的镀镍层，前述镀镍层的厚度T相对于前述镀钴层的厚度T和前述镀镍层的厚度T的总计之比(T/(T+T))为0.2～0.9，前述镀镍层的最表面的(220)面的晶体取向性指数为0.8以上。