Curable resin composition, adhesive agent, adhesive film, circuit substrate, interlayer insulating material, and printed wiring board

• Main Authors: WAKIOKA SAYAKA, OATARI YUTA, BABA SUSUMU, SHINJO TAKASHI, KAWAHARA YUKO, TAKEDA KOHEI, HAYASHI TATSUSHI, SHINDO MASAMI
• Format: Patent
• Language: Chinese; English
• Published: 11.09.2020
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; DYES; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; POLISHES; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF MATERIALS AS ADHESIVES

A purpose of the present invention is to provide a curable resin composition that has a high flexibility and good workability before curing and shows a high adhesiveness, high thermal resistance and excellent dielectric properties after curing. Another purpose of the present invention is to provide an adhesive agent, an adhesive film, a circuit substrate, an interlayer insulating material and a printed wiring board each produced by using the curable resin composition. The curable resin composition according to the present invention comprises a curable resin and an imide oligomer, wherein the imide oligomer is an aliphatic diamine residue and/or aliphatic triamine residue-containing imide oligomer having an imide skeleton and an optionally substituted aliphatic diamine residue having 4 or more carbon atoms and/or an optionally substituted aliphatic triamine residue having 4 or more carbon atoms in the main chain, a crosslinkable functional group at a terminus and a molecular weight of not more than 5,000. 本发明的