Curable resin composition, adhesive agent, adhesive film, circuit substrate, interlayer insulating material, and printed wiring board
A purpose of the present invention is to provide a curable resin composition that has a high flexibility and good workability before curing and shows a high adhesiveness, high thermal resistance and excellent dielectric properties after curing. Another purpose of the present invention is to provide...
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Main Authors | , , , , , , , |
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Format | Patent |
Language | Chinese English |
Published |
11.09.2020
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Subjects | |
Online Access | Get full text |
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Summary: | A purpose of the present invention is to provide a curable resin composition that has a high flexibility and good workability before curing and shows a high adhesiveness, high thermal resistance and excellent dielectric properties after curing. Another purpose of the present invention is to provide an adhesive agent, an adhesive film, a circuit substrate, an interlayer insulating material and a printed wiring board each produced by using the curable resin composition. The curable resin composition according to the present invention comprises a curable resin and an imide oligomer, wherein the imide oligomer is an aliphatic diamine residue and/or aliphatic triamine residue-containing imide oligomer having an imide skeleton and an optionally substituted aliphatic diamine residue having 4 or more carbon atoms and/or an optionally substituted aliphatic triamine residue having 4 or more carbon atoms in the main chain, a crosslinkable functional group at a terminus and a molecular weight of not more than 5,000.
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Bibliography: | Application Number: CN201980010439 |