Dendritic copper electrode with hydrophobic surface and preparation method and application thereof

• Main Authors: GAO FEIYUE, GAO MINRUI, YANG PENGPENG, NIU ZHUANGZHUANG
• Format: Patent
• Language: Chinese; English
• Published: 11.09.2020
• Subjects: APPARATUS THEREFOR; CHEMISTRY; ELECTROFORMING; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTIONOF COMPOUNDS OR NON-METALS; METALLURGY; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS

The invention belongs to the technical field of electrocatalysis, and particularly relates to a dendritic copper electrode with a hydrophobic surface and a preparation method and application thereof.The copper electrode provided by the invention comprises a gas diffusion layer and a copper layer deposited on the surface of the gas diffusion layer, and the microstructure of the copper layer is dendritic. The surface of the copper electrode is composed of regular copper dendrites, so that good hydrophobicity is shown and excessive contact of electrolyte can be effectively prevented, and therebyflooding of the electrode is avoided, and the stability of the electrode is improved; in addition, the dendritic copper can efficiently enrich cations in the electrolyte to form a local high electricfield, so that the carbon-carbon coupling rate is increased, and the electrode shows excellent electro-catalytic CO2 reduction activity. 本发明属于电催化技术领域，尤其涉及一种表面疏水的枝晶状铜电极及其制备方法和应用。本发明提供的铜电极包括气体扩散层和沉积在所述气体扩散层表面的铜层；所述铜层的微观形貌为枝晶状。本发