Manufacturing method of step structure and vibration detection device

• Main Author: HE ZHENGDA
• Format: Patent
• Language: Chinese; English
• Published: 11.09.2020
• Subjects: MEASURING; MICROSTRUCTURAL TECHNOLOGY; PERFORMING OPERATIONS; PHYSICS; PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS; TESTING; TESTING STATIC OR DYNAMIC BALANCE OF MACHINES ORSTRUCTURES; TESTING STRUCTURES OR APPARATUS NOT OTHERWISE PROVIDED FOR; TRANSPORTING

The invention discloses a manufacturing method of a step structure and a vibration detection device. The manufacturing method of the step structure comprises the following steps: performing wet etching on a first surface of a wafer to form a pit structure, manufacturing a graphical mask layer on the first surface of the wafer etched with the pit structure and the pit structure, forming an openingat least exposing the edge of the pit structure by the graphical mask layer, and etching the wafer by a dry method by taking the graphical mask layer as a mask to obtain the step structure, wherein the vibration detection device comprises the step structure. According to the manufacturing method of the step structure and the vibration detection device, only one-time dry etching is adopted for manufacturing the step structure, the dry etching frequency in the manufacturing of the step structure is effectively reduced, the etching interference among multiple times of dry etching is reduced, theetching effect of dry etch