Flip-chip sample imaging devices with self-aligning lid

• Main Authors: ZHANG MING, QIAN YIN, TAI DYSON H, MIAO CHIAUN
• Format: Patent
• Language: Chinese; English
• Published: 08.09.2020
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A flip-chip sample imaging device with self-aligning lid includes an image sensor chip, a fan-out substrate, and a lid. The image sensor chip includes (a) a pixel array sensitive to light incident ona first side of the image sensor chip and (b) first electrical contacts disposed on the first side and electrically connected to the pixel array. The fan-out substrate is disposed on the first side, is electrically connected to the first electrical contacts, forms an aperture over the pixel array to partly define a sample chamber over the pixel array, and forms a first surface facing away from thefirst side. The lid is disposed on the first surface of the fan-out substrate, facing away from the first side, to further define the chamber. The lid includes an inner portion protruding into the aperture to align the lid relative to the fan-out substrate. 一种具有自对准盖的倒装芯片样本成像设备包括图像传感器芯片、扇出基板和盖子。图像传感器芯片包括(a)对入射在图像传感器芯片的第一侧上的光敏感的像素阵列，以及(b)布置在第一侧上并且电连接到像素阵列的第一电触点。扇出基板布置在第一侧上、电连接到第一电触点、在像素阵列上方形成孔以部分地限定像素阵列上方的腔室、并且形成背离第一侧的第一表面。