RESIN COMPOSITION, PREPREG, RESIN-INCLUDING FILM, RESIN-INCLUDING METAL FOIL, METAL-CLAD LAMINATE, AND WIRING BOARD

• Main Authors: SHINPO TAKASHI, NAKAMURA YOSHIHIKO, FUJISAWA HIROYUKI, TUMURAYA YUUJI, TOSHIMITSU KENICHI, YAMAUCHI AKIHIRO
• Format: Patent
• Language: Chinese; English
• Published: 04.09.2020
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL PROCESSES OF COMPOUNDING; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; WORKING-UP

Provided is a resin composition containing a maleimide compound represented by formula (1), a modified polyphenylene ether compound in which the ends are modified by a substituent having a carbon-carbon unsaturated double bond, and a crosslinking agent containing an allyl compound. In formula (1), s represents 1-5, RA, RB, RC, and RD each independently represent a hydrogen atom, an alkyl group having 1-5 carbon atoms, or a phenyl group. 一种树脂组合物，其含有：下述式(1)所示的马来酰亚胺化合物；改性聚苯醚化合物，末端被具有碳-碳不饱和双键的取代基改性；以及交联剂，包含烯丙基化合物。式(1)中，s表示1～5，R、R、R及R分别独立地表示氢原子、碳数1～5的烷基或苯基。