Package integrated waveguide

• Main Authors: PARMON WALTER, HAYES SCOTT M
• Format: Patent
• Language: Chinese; English
• Published: 04.09.2020
• Subjects: ANALOGOUS ARRANGEMENTS USING OTHER WAVES; ANTENNAS, i.e. RADIO AERIALS; BASIC ELECTRIC ELEMENTS; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION ORRERADIATION OF RADIO WAVES; MEASURING; PHYSICS; RADIO DIRECTION-FINDING; RADIO NAVIGATION; SEMICONDUCTOR DEVICES; TESTING

The disclosure relates to package integrated waveguide. A method of manufacturing a packaged semiconductor device including forming an assembly by coupling a semiconductor die and an antenna by way ofa substrate, contacting with a conformal structure at least a portion of a first surface of the antenna, and encapsulating the assembly with an encapsulant such that the at least a portion of the first surface of the antenna contacted by the conformal structure is not encapsulated with the encapsulant. 本公开涉及封装集成波导。制造封装半导体装置的方法包括通过借助于基板联接半导体管芯和天线来形成组件、使所述天线的第一表面的至少一部分与共形结构接触，和用包封体包封所述组件，使得由所述共形结构接触的所述天线的所述第一表面的所述至少一部分没有用所述包封体包封。