Temporary bonding and de-bonding method based on graphite

• Main Authors: GUO JING, ZHU ZHIYUAN, HAN ZHICHENG
• Format: Patent
• Language: Chinese; English
• Published: 28.08.2020
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention discloses a temporary bonding and de-bonding method based on graphite, which comprises the steps of 1, providing a piece of slide glass, and regularly forming a groove with a certain shape on the front surface of the slide glass; and 2, placing graphite in the groove of the slide glass; 3, arranging bonding glue on the front surface of the slide glass and a device wafer; 4, bonding the front surface of the device wafer and the front surface of the slide glass to obtain a temporary wafer bonding pair; 5, for the processed temporary wafer bonding pair, processing the back surface of the device wafer; and 6, carrying out de-bonding on the front surface of the device wafer and the front surface of the slide glass, and separating the device wafer from the slide glass. According tothe method, the bonding layer can be directly heated, rapid bonding is realized, and de-bonding is rapidly carried out under low-temperature heating. 本发明公开了一种基于石墨的临时键合和解键方法，该方法包括以下步骤：步骤1、提供一载片，在所述载片的正面规则的开一定形状的槽。步骤2、在所述载片的槽中