WAFER PROBER

The present invention relates to a wafer prober. The wafer prober has a wafer probing stage comprising: a lower plate; multiple elevating columns mounted on the upper surface of the lower plate; and an upper plate mounted on the upper-end portion of the multiple elevating columns. Each of the multip...

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Bibliographic Details
Main Authors PARK NAM WOO, PARK KI TACK
Format Patent
LanguageChinese
English
Published 21.08.2020
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Summary:The present invention relates to a wafer prober. The wafer prober has a wafer probing stage comprising: a lower plate; multiple elevating columns mounted on the upper surface of the lower plate; and an upper plate mounted on the upper-end portion of the multiple elevating columns. Each of the multiple elevating columns is configured to move upward/downward between the upper plate and the lower plate, and the height and inclination of the upper plate are adjusted according to the upward/downward movement of the elevating columns. The wafer probing stage adjusts the height of each elevating column according to the load applied to each elevating column such that the height of a chuck placed above the upper plate and the inclination or flatness of the chuck can be adjusted accordingly. 本发明涉及一种晶片探测器。所述晶片探测器的晶片检测工作台,包括:下板;多个升降柱,其搭载于所述下板的上部表面;及上板,其搭载于所述多个升降柱的上端部,并且,所述各个多个升降柱在上板与下板之间上升/下降,所述上板的高度及倾斜度通过所述升降柱的上下移动而调整。所述晶片检测工作台根据向各个升降柱施加的荷重调整各个升降柱的高度,而能够调整配置在上板上面的卡盘的高度及卡盘的倾斜度或平坦度。
Bibliography:Application Number: CN201980006239