SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

The present invention provides a substrate processing apparatus and a substrate processing method for suppressing pattern collapse on a wafer when dried using a processing fluid in a supercritical state. The substrate processing apparatus includes a supercritical fluid producing apparatus including...

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Bibliographic Details
Main Author GOSHI GENTARO
Format Patent
LanguageChinese
English
Published 14.08.2020
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:The present invention provides a substrate processing apparatus and a substrate processing method for suppressing pattern collapse on a wafer when dried using a processing fluid in a supercritical state. The substrate processing apparatus includes a supercritical fluid producing apparatus including a pump configured to send out a processing fluid; a processing container configured to perform a supercritical fluid processing on a substrate with a processing fluid in a supercritical state sent from the supercritical fluid producing apparatus; and a controller configured to control at least the supercritical fluid producing apparatus. When a pressure increase is performed within the processing container by using the processing fluid, the controller determines a first supply rate at which theprocessing fluid is supplied to the processing container based on a target time during which the pressure increase is performed, an amount of the processing fluid required for the pressure increase and a density of the proces
Bibliography:Application Number: CN202010081888