DRY FILM, CURED PRODUCT AND ELECTRONIC COMPONENT

• Main Authors: ENDO ARATA, HARIMA EIJI, NAKAI KOSHIN
• Format: Patent
• Language: Chinese; English
• Published: 07.08.2020
• Subjects: APPARATUS SPECIALLY ADAPTED THEREFOR; CINEMATOGRAPHY; ELECTROGRAPHY; HOLOGRAPHY; MATERIALS THEREFOR; ORIGINALS THEREFOR; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS

The invention relates to a dry film, a cured product and an electronic component. The invention provides the dry film in which resin does not adhere to a blade and shapeness does not reduce when cutting processing is continuously performed, as a result, damage and floating of the resin at ends and protecting film floating are prevented. The dry film is provided with a carrier film, a resin layer and the protecting film. The dry film is characterized in that the peeling strength of the protecting film to the resin layer is above 0.010kgf/cm, and furthermore the peeling strength of the protecting film to the resin layer is higher than the peeling strength of the carrier film to the resin layer. 本发明涉及干膜、固化物和电子部件。[课题]提供：即使连续地进行分切加工，树脂也不附着于刀、且锋利度不变差，作为结果，不产生端部处的树脂的破损、浮起、保护膜的浮起的干膜。[解决方案]一种干膜，其具备载体膜、树脂层和保护膜，其特征在于，保护膜对树脂层的剥离强度为0.010kgf/cm以上，且保护膜对树脂层的剥离强度大于载体膜对树脂层的剥离强度。