Semiconductor processing device

• Main Author: JIA LISONG
• Format: Patent
• Language: Chinese; English
• Published: 07.08.2020
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SEMICONDUCTOR DEVICES; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

The embodiment of the application provides a semiconductor processing device. The semiconductor processing device includes a process chamber, a loading chamber, and a flower basket; a positioning plate for carrying the flower basket is arranged in the loading chamber; the bottom plate of the flower basket is provided with a feeding end and a stop end arranged oppositely; a plurality of accommodating grooves arranged in a stacked manner are arranged in the flower basket, and the opening of each accommodating groove is located on the side of the feeding end; the positioning plate is provided with a telescopic piece, which is used for pressing the bottom plate to tilt the flower basket when the flower basket is placed on the positioning plate so that the feeding end is higher than the stop end, and then retracting gradually so that the flower basket is flat on the positioning plate. Through the embodiment of the application, the impact generated between the flower basket and the positioning plate is effectively