Low-temperature forming method of unsaturated bulk molding compound

• Main Authors: SONG NING, XU XINMIN, ZHOU QUAN, NI LIZHONG
• Format: Patent
• Language: Chinese; English
• Published: 04.08.2020
• Subjects: CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

The invention relates to a low-temperature forming method of an unsaturated bulk molding compound, which is a microcapsule low-temperature initiator prepared by taking peroxide as a core material andcrystalline polyester as a wall material and is used for preparing the bulk molding compound. The conventional bulk molding compound is relatively high in molding temperature; generally, the curing time is relatively long at 150 DEG C; the bulk molding compound prepared from the microcapsule low-temperature initiator can be quickly cured and molded under a low-temperature condition, so that the problems of high molding temperature and short shelf life of the bulk molding compound are effectively solved, the energy is saved, and the shelf life and the production efficiency of the bulk molding compound are improved. The low-temperature forming method of the bulk molding compound is suitable for glass fiber and fabric reinforced unsaturated polyester bulk molding compounds of the glass fiber,and can be applied to the