Adhesively joined cooling plate

• Main Authors: BRISBANE ROGER M, SCHOENHERR ROBERT J, FAST TODD H, MAZZA JASON
• Format: Patent
• Language: Chinese; English
• Published: 17.07.2020
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRICITY; PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSIONOF CHEMICAL INTO ELECTRICAL ENERGY

In an embodiment, a cooling plate comprises a first substrate and a second substrate, wherein the first substrate and the second substrate are adhesively bonded via an adhesive layer, a conduit is formed between the first substrate and the second substrate and has an inlet and an outlet so as to form a flow field for a coolant to flow through, the adhesion layer forms a tight fluid seal to preventleakage of the coolant from the conduit to a bonded region proximal to the conduit area between the first substrate and the second substrate. 在实施例中，冷却板包括第一基板和第二基板；其中，第一基板和第二基板经由粘合剂层粘合在一起；其中，导管形成在第一基板和第二基板之间，导管具有入口和出口，形成用于冷却剂流过的流场；其中，所述粘合剂层形成紧密的流体密封以防止冷却剂从导管泄露到第一基板和第二基板之间的导管区域附近的结合区域。