Processing equipment and method before metal electroplating

• Main Author: ZOU BENHUI
• Format: Patent
• Language: Chinese; English
• Published: 17.07.2020
• Subjects: APPARATUS THEREFOR; CHEMISTRY; ELECTROFORMING; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; METALLURGY; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS

The invention provides processing equipment and method before metal electroplating. The processing equipment before metal electroplating includes a vacuum device, a closed heating device and a hydrogen device; the vacuum device communicates with the closed heating device; the hydrogen device communicates with the closed heating device; the closed heating device is used for heating metal; the vacuum device is used for vacuum processing metal in the closed heating device; and the hydrogen device is used for introducing hydrogen gas into the closed heating device. The processing equipment is usedto improve the bonding force of the electroplated metal. 本申请提供一种金属电镀前的处理设备及处理方法。金属电镀前的处理设备，包括：真空装置；密闭加热装置，所述真空装置与所述密闭加热装置连通；氢气装置，所述氢气装置与所述密闭加热装置连通；其中，所述密闭加热装置用于加热金属；所述真空装置用于对所述密闭加热装置内的金属进行真空处理；所述氢气装置用于往所述密闭加热装置中通入氢气。该处理设备用以提高电镀金属的结合力。