Solder particles, electroconductive material, solder particle storage method, electroconductive material storage method, electroconductive material production method, connection structure, and connection structure production method

• Main Authors: YAMANAKA YUTA, SOU SHIKE, ITOU MASAHIRO, SAITOU SATOSHI, SADANAGA SHUUJIROU
• Format: Patent
• Language: Chinese; English
• Published: 14.07.2020
• Subjects: ALLOYS; BASIC ELECTRIC ELEMENTS; CABLES; CHEMISTRY; CLADDING OR PLATING BY SOLDERING OR WELDING; CONDUCTORS; CURRENT COLLECTORS; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; ELECTRICITY; FERROUS OR NON-FERROUS ALLOYS; INSULATORS; LINE CONNECTORS; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; METALLURGY; PERFORMING OPERATIONS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES; SOLDERING OR UNSOLDERING; TRANSPORTING; TREATMENT OF ALLOYS OR NON-FERROUS METALS; WELDING; WORKING BY LASER BEAM

Provided are solder particles capable of effectively increasing the coalescence of solder when forming electroconductive connections. The solder particles according to the present invention comprise an oxide film on the surfaces thereof. The particle sizes of the solder particles is 1 [mu]m to 15 [mu]m, inclusive. When the solder particles have been heated at 120 DEG C for 10 hours in an air atmosphere, the ratio of the average thickness of the oxide film before heating to the average thickness of the oxide film after heating is 2/3 or less. 本发明提供一种焊锡粒子，其具有焊锡粒子主体、以及配置于所述焊锡粒子主体的外表面上的氧化被膜，所述焊锡粒子的粒径为1μm以上且15μm以下，将所述焊锡粒子在空气氛围下以120℃加热10小时时，加热前的所述氧化被膜的平均厚度与加热后的氧化被膜的平均厚度之比为2/3以下。