MAGNET ASSEMBLY OF MAGNETRON SPUTTERING DEVICE

• Main Authors: KIM JUNG-GUN, SO BYUNG-HO, KO MU-SEOK, BYEON DONG-BEOM
• Format: Patent
• Language: Chinese; English
• Published: 03.07.2020
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS; ELECTRICITY; INDUCTANCES; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; MAGNETS; METALLURGY; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; TRANSFORMERS

According to one embodiment, a magnet assembly of a magnetron sputtering device can comprise: a yoke; an electromagnet arranged on the yoke and having magnetic poles differing from each other with respect to a direction orthogonal to the yoke; and a permanent magnet arranged on the yoke so as to be spaced from the electromagnet, having magnetic poles formed to be opposite those of the electromagnet, and encompassing at least a portion of the electromagnet. 根据一实施例的磁控溅射装置的磁体集合体，其包括：磁轭；电磁体，配置在所述磁轭上，在垂直于所述磁轭的方向上具有不同的磁极；以及永久磁体，以与所述电磁体分隔的方式配置在所述磁轭上，并且，围绕所述电磁体的至少一部分。