Sidelobe cutting method and device
The invention discloses a sidelobe cutting method and a device using the sidelobe cutting method and relates to the field of array digital beam forming radiation source receiving. The device comprisesDBF receiving arrays with two or more surfaces, wherein each DBF receiving array comprises a channel...
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Main Authors | , , , , , , |
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Format | Patent |
Language | Chinese English |
Published |
03.07.2020
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Subjects | |
Online Access | Get full text |
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