Sidelobe cutting method and device

The invention discloses a sidelobe cutting method and a device using the sidelobe cutting method and relates to the field of array digital beam forming radiation source receiving. The device comprisesDBF receiving arrays with two or more surfaces, wherein each DBF receiving array comprises a channel...

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Bibliographic Details
Main Authors WANG JIAN, WU YONGLUN, LONG XIAOZHUAN, HA ZHANG, WANG BING, LU JUNHUA, LI DUN
Format Patent
LanguageChinese
English
Published 03.07.2020
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Summary:The invention discloses a sidelobe cutting method and a device using the sidelobe cutting method and relates to the field of array digital beam forming radiation source receiving. The device comprisesDBF receiving arrays with two or more surfaces, wherein each DBF receiving array comprises a channel for forming a main beam, part of the channels are extracted to form sidelobe cutting beams while the main beam is formed, channel data of each array are collected to form a main beam of each array, a certain number of channel data of each array are extracted to form a first tangent sidelobe beam of each array, each first tangent sidelobe wave beam is processed to obtain a second tangent sidelobe wave beam, the second tangent sidelobe wave beam is used for carrying out sidelobe suppression of asignal in a main wave beam sidelobe incoming wave direction, each main wave beam is processed by using the second sidelobe cutting wave beam to finish signal receiving in the main wave beam coveragedirection, as the channel d
Bibliography:Application Number: CN202010090929