5G antenna flexible insulation cooling fin and preparation process thereof

• Main Authors: CHEN LEI, LIAO MAOLIN, CAO FUYING, LIU ZAIXUAN, MA QIANQIAN
• Format: Patent
• Language: Chinese; English
• Published: 19.06.2020
• Subjects: ADHESIVES; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; ANTENNAS, i.e. RADIO AERIALS; BASIC ELECTRIC ELEMENTS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; DYES; ELECTRICITY; GENERAL PROCESSES OF COMPOUNDING; MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; POLISHES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; WORKING-UP

The invention provides a 5G antenna flexible insulation cooling fin, which comprises 60% of a component A, 39%-39.8% of a component B and 0.2%-1% of a dispersing agent A, wherein the component A comprises the following raw materials: 30%-80% of high-thermal-conductivity insulating powder, 0.2%-1% of a dispersing agent B and 20%-70% of a solvent A, and the component B comprises the following raw materials: 30%-60% of a resin and 40%-70% of a solvent B. According to the invention, the component A, the component B and the dispersing agent A are mixed to prepare the cooling fin, the resin with lowdielectric loss is adopted, the dielectric loss is small, the advantages of being soft and bendable are achieved after resin film forming, and the added high-thermal-conductivity insulating powder can meet the high heat dissipation requirement in 5G antenna application. The invention further provides a preparation process of the 5G antenna flexible insulation cooling fin. According to the invention, the preparation proce