Device and method for removing surface damage of wafer by alkali corrosion

• Main Authors: BIAN YONGZHI, LIU ZUOXING, XU JIPING, LU LIYAN, CHENG FENGLING, NING YONGDUO, ZHONG GENGHANG, CHEN HE
• Format: Patent
• Language: Chinese; English
• Published: 09.06.2020
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention discloses a device and a method for removing surface damage of a wafer through alkali corrosion. The device comprises a corrosion carrier, a manipulator, a corrosion process tank and analkali liquor preparation tank, wherein the corrosion carrier comprises two side plates and three toothed rotating rods installed between the two side plates, and gears are arranged at the two ends ofeach toothed rotating rod; a central driving gear and a carrier driving gear are further arranged on the outer sides of the two side plates respectively, and the carrier driving gear is meshed with the gears at the two ends of each toothed rotating rod; the manipulator comprises a transmission gear set and a carrier driving motor; the transmission gear set of the manipulator drives the central driving gear to drive the toothed rotating rod to rotate; the corrosion process tank is connected with the alkali liquor preparation tank through an alkali liquor circulating liquid return pipe and an alkali liquor circulating l