Resin composition and cured resin composition

• Main Authors: SHIEH TIEN-SHOU, CHIEN PEI-HSIN
• Format: Patent
• Language: Chinese; English
• Published: 05.06.2020
• Subjects: ADHESIVES; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CHEMICAL PAINT OR INK REMOVERS; CHEMISTRY; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; CORRECTING FLUIDS; DYES; FILLING PASTES; GENERAL PROCESSES OF COMPOUNDING; INKS; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; POLISHES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF MATERIALS THEREFOR; WOODSTAINS; WORKING-UP

A resin composition is provided, which includes an oligomer formed by reacting bisphenol epoxy resin monomer, aliphatic diglycidyl ether, anhydride compound, and catalyst, wherein the molar ratio of epoxy groups of the bisphenol epoxy resin monomer and aliphatic diglycidyl ether to anhydride groups of the anhydride compound is between 3.5:1 and 8.8:1. The bisphenol epoxy resin monomer and aliphatic diglycidyl ether have a molar ratio of 0.3:1 to 1.3:1, and the viscosity of the resin composition is 20 Pa.s to 80 Pa.s at 25 deg C. 本发明提供的树脂组合物，包括：双酚型环氧树脂单体、脂肪族二缩水甘油醚、酸酐化合物、与催化剂反应而成的低聚物，其中双酚型环氧树脂单体和脂肪族二缩水甘油醚的环氧基，与酸酐化合物的酸酐基的摩尔比介于3.5:1至8.8:1之间，其中双酚型环氧树脂单体与脂肪族二缩水甘油醚的摩尔比介于0.3:1至1.3:1之间；以及其中树脂组合物在25℃下的粘度介于20Pa.s至80Pa.s之间。