Efficient heat dissipation insulating lining plate

• Main Authors: WANG YUQI, SHI HAIDING, XU NINGHUA, LUO HAIHUI, WU YIBO, PENG YONGDIAN, CHANG GUIQIN, TONG YAN, FANG JIE
• Format: Patent
• Language: Chinese; English
• Published: 02.06.2020
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention provides an efficient heat dissipation insulating lining plate which comprises an upper metal layer, a ceramic layer and a lower metal layer which are sequentially arranged in a stackedmode, a flow channel structure is arranged in the ceramic layer, and the flow channel structure is fully distributed in a heating area of a semiconductor chip. According to the invention, the channelstructure is arranged in the insulating lining plate ceramic layer; the design of the insulating lining plate with an efficient heat dissipation effect is no longer limited by selection of material characteristics, direct heat dissipation between the semiconductor chip and the cooling liquid can be realized, an internal heat dissipation path of a module is improved, the heat dissipation efficiencyof the module is enhanced, and the thermal stability and the long-term reliability of the power module are improved. 本发明提出了一种高效散热绝缘衬板，包括依次层叠设置的上金属层、陶瓷层和下金属层，所述陶瓷层内设置有流道结构，所述流道结构布满半导体芯片的发热区域。本发明的绝缘衬板陶瓷层内部设置有通道结构，使得高效散热效果的绝缘衬板设计