PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD PRODUCTION METHOD

• Main Authors: OKAUE JUNICHI, OHSUKA RYUTA, SAKAI SHOICHIRO, NITTA KOJI
• Format: Patent
• Language: Chinese; English
• Published: 26.05.2020
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

In one mode of the present invention, the printed circuit board comprises an insulating base film, an electroconductive pattern layered on parts of the top surface side of the base film, a covering layer layered on the top surface of a layered body containing the base film and the electroconductive pattern, and having openings that partially expose the electroconductive pattern, and a tin-platinglayer layered on the top surface of the electroconductive pattern so as to be exposed through the openings. With the inner edge of the opening section serving as the reference end, the mean detachmentlength of the covering layer from the electroconductive pattern is 20 [mu]m or shorter. 根据本发明的一个方面，印刷电路板包括：绝缘基膜；导电图案，该导电图案被部分地层叠在基膜的表面侧上；涂层，该涂层被层叠在包括基膜和导电图案并且具有部分地暴露导电图案的开口部的层叠结构的表面上；以及镀锡层，该镀锡层层叠在从开口部暴露的导电图案的表面上，其中，以开口部的内边缘作为基端，涂层从导电图案的平均剥离长度小于或者等于20μm。