HEAT DISSIPATION MODULE, DISPLAY DEVICE AND ASSEMBLY METHOD

• Main Authors: CHI-WEN CHU, YUN AN CHANG
• Format: Patent
• Language: Chinese; English
• Published: 19.05.2020
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FREQUENCY-CHANGING; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; NON-LINEAR OPTICS; OPTICAL ANALOGUE/DIGITAL CONVERTERS; OPTICAL LOGIC ELEMENTS; OPTICS; PHYSICS; PRINTED CIRCUITS; TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF

The disclosure relates to a heat dissipation module, a display device having the same, and an assembly method thereof. Place the heat dissipation structure in between the chip of the COF (chip-on-film) and the thermal-conductive supporting component, heat generated by the chip of the COF can be absorbed by the heat dissipation structure and then be transferred to the thermal-conductive supportingcomponent through the heat dissipation structure. As a result, the temperature of the chip is decreased, and the chip is avoided from operating at high temperature to deteriorate its performance and to result in thermal deformation or any other negative effects on the nearby components. 本发明公开一种散热模块与包含其的显示装置与其组装方法，其中通过组装散热结构位于薄膜倒装封装的芯片与导热支撑构件之间，使薄膜倒装封装的芯片所产生的热经由热传导于散热结构，再由散热结构热传导于导热支撑构件，降低薄膜倒装封装的芯片的温度，以避免芯片运作效能降低、并减少附近的结构产生热变形与变质。