Multilayer ceramic electronic component and multilayer ceramic electronic component package
The invention provides a multilayer ceramic electronic component and a multilayer ceramic electronic component package. The multilayer ceramic electronic component comprises a ceramic body including adielectric layer and first and second internal electrodes stacked to be alternately exposed to the f...
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Main Authors | , , , , , |
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Format | Patent |
Language | Chinese English |
Published |
19.05.2020
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Subjects | |
Online Access | Get full text |
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Summary: | The invention provides a multilayer ceramic electronic component and a multilayer ceramic electronic component package. The multilayer ceramic electronic component comprises a ceramic body including adielectric layer and first and second internal electrodes stacked to be alternately exposed to the first and second outer sides with the dielectric layer interposed therebetween; and first and secondexternal electrodes disposed on the first and second outer sides of the ceramic body and extended in the longitudinal direction along the surface of the ceramic body to be respectively connected to the corresponding internal electrode of the first and second internal electrode. The longest length in the longitudinal direction from the first external electrode to the second external electrode is La, the shortest length in the longitudinal direction from the first external electrode to the second external electrode is Lb, and Lb/La is greater than 0 and 0.6 or less.
本发明提供了一种多层陶瓷电子组件和多层陶瓷电子组件封装件。所述多层陶瓷电子组件包括:陶瓷主体,包括介电层以及 |
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Bibliography: | Application Number: CN201910271106 |