Low-density low-pressure sheet molding compound and preparation method thereof

• Main Authors: HUANG ZHIXIONG, SHI MINXIAN, OU YUN, REN YILIN, TANG QINGXIU, QIN YAN, DONG CHUANG, GE DUAN
• Format: Patent
• Language: Chinese; English
• Published: 19.05.2020
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; GENERAL PROCESSES OF COMPOUNDING; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; WORKING-UP

The invention provides a low-density low-pressure sheet molding compound and a preparation method thereof. The invention discloses a low-density low-pressure sheet molding compound. The composite material is prepared from the following components in parts by weight: 55 to 65 parts of unsaturated polyester resin, 30 to 40 parts of low-shrinkage additive, 6 to 8 parts of styrene, 3.5 to 4.5 parts ofthickening agent, 1 to 2 parts of benzoyl peroxide tert-butyl ester, 4 to 6 parts of light zinc stearate, 70 to 80 parts of calcium carbonate, 20 to 30 parts of hollow glass beads and 45 to 55 partsof chopped glass fibers. According to the invention, a low-pressure sheet molding compound (LPMC) technology is adopted; mutual cooperation of components, therefore, the sheet molding compound prepared by the invention has lower density and the forming pressure can be greatly reduced; the magnesium oxide paste and the crystalline resin are used as a combined thickening system, so that the materialis formed under low pressu