Electroplating device

The invention discloses an electroplating device. The electroplating device comprises an electroplating container for holding electroplating bath, a cathode member arranged in the electroplating container, an anode member arranged in the electroplating container, a direct-current power supply and a...

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Bibliographic Details
Main Authors ZHAO JIANGBIN, SHAO JUNQI, YANG FANGDONG, HE GAOKUI
Format Patent
LanguageChinese
English
Published 15.05.2020
Subjects
APPARATUS THEREFOR
CHEMISTRY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
METALLURGY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Summary:The invention discloses an electroplating device. The electroplating device comprises an electroplating container for holding electroplating bath, a cathode member arranged in the electroplating container, an anode member arranged in the electroplating container, a direct-current power supply and a temperature control member, wherein a positive pole of the direct-current power supply is electrically connected to the anode member, and a negative pole of the direct-current power supply is electrically connected to the cathode member; the electroplating container is arranged in the temperature control member; the temperature control member controls the temperature of the electroplating bath; the anode member comprises a first anode member and a second anode member; the first anode member is arranged on a first side surface of the cathode member; and the second anode member is arranged on a second side surface, away from the first anode member, of the cathode member. Through use of the technical scheme, the first
Bibliography:Application Number: CN202010034356