Electroplating device
The invention discloses an electroplating device. The electroplating device comprises an electroplating container for holding electroplating bath, a cathode member arranged in the electroplating container, an anode member arranged in the electroplating container, a direct-current power supply and a...
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Main Authors | , , , |
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Format | Patent |
Language | Chinese English |
Published |
15.05.2020
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Subjects | |
Online Access | Get full text |
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Summary: | The invention discloses an electroplating device. The electroplating device comprises an electroplating container for holding electroplating bath, a cathode member arranged in the electroplating container, an anode member arranged in the electroplating container, a direct-current power supply and a temperature control member, wherein a positive pole of the direct-current power supply is electrically connected to the anode member, and a negative pole of the direct-current power supply is electrically connected to the cathode member; the electroplating container is arranged in the temperature control member; the temperature control member controls the temperature of the electroplating bath; the anode member comprises a first anode member and a second anode member; the first anode member is arranged on a first side surface of the cathode member; and the second anode member is arranged on a second side surface, away from the first anode member, of the cathode member. Through use of the technical scheme, the first |
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Bibliography: | Application Number: CN202010034356 |