一种具有直裂纹或异质拼接材料的热性能分析方法

• Format: Patent
• Language: Chinese
• Published: 22.03.2024
• Subjects: CALCULATING; COMPUTING; COUNTING; ELECTRIC DIGITAL DATA PROCESSING; INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTEDFOR SPECIFIC APPLICATION FIELDS; PHYSICS

本发明公开了一种具有直裂纹或异质拼接材料的热性能分析方法；通过分析材料裂纹和异质拼接问题的实际物理过程，对模型进行分析和合理假设；给出描述材料裂纹和异质拼接传热过程的数学描述及控制方程；根据裂纹和异质拼接线的参数和厚度、热传导系数等特点，提出描述夹层上物理量不连续条件的界面边界条件；采用数学方法对断裂材料或异质拼接材料导热模型进行离散，得到离散线性方程组；对离散线性方程组进行求解，并分析结果；该方法能够降低研发成本、缩短研发周期、快速、精确。本方法通过数学模型及数值模拟的方法，能够方便快捷的预测裂纹材料或异质拼接材料导热过程中的温度变化，从而可以对其传热性能进行评估和指导。 The invention discloses a thermal performance analysis method for a material with straight cracks or heterogeneous splicing. The method comprises: analyzing and reasonably assuming a model by analyzing the actual physical process of the crack and heterogeneous splicing problems of a material; providing a mathematical description and control equation for describing the cracks and the heterogeneoussplicing heat transfer process of the material; proposing an interface boundary condition for describing a physical quantity discontinuity condition on an interlayer according to the characteristics of the parameters and the thicknesses of the cracks and the heterogeneous splicing lines, the heat conduction coefficients and the like