Multilayer substrate forming method and multilayer substrate forming apparatus

• Main Author: OSHIMA EIJI
• Format: Patent
• Language: Chinese; English
• Published: 05.05.2020
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

The invention provides a multilayer substrate forming method for forming a multilayer substrate by using one device and the device thereof. The multilayer substrate forming method includes: a fixing step of fixing a substrate on a table; a first layer forming step of forming a mixed material layer in which a conductive material and a photocurable resin are mixed on the substrate fixed to the table; a first exposure step of exposing the mixed material layer to a laser scan corresponding to the first circuit pattern data; a first cleaning step of cleaning the mixed material on the exposed substrate; a second layer forming step of forming an insulating resin layer on the cleaned substrate; a second exposure step of exposing the insulating resin layer by laser scanning corresponding to the through-hole data; a second cleaning step of cleaning the insulating resin on the exposed substrate; a third layer forming step of forming a mixed material layer on the cleaned substrate; a third exposure step of exposing the m