Semiconductor package

• Main Authors: CHAE SEUNG HUN, MOON SO YEON, SEO YOUNG KWAN
• Format: Patent
• Language: Chinese; English
• Published: 05.05.2020
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention provides a semiconductor package. The semiconductor package includes a semiconductor chip having a connection pad; an encapsulant covering at least a portion of the semiconductor chip; and an interconnect structure disposed on the semiconductor chip and the encapsulant. The interconnec...