Semiconductor package

• Main Authors: CHAE SEUNG HUN, MOON SO YEON, SEO YOUNG KWAN
• Format: Patent
• Language: Chinese; English
• Published: 05.05.2020
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention provides a semiconductor package. The semiconductor package includes a semiconductor chip having a connection pad; an encapsulant covering at least a portion of the semiconductor chip; and an interconnect structure disposed on the semiconductor chip and the encapsulant. The interconnect structure includes a first insulating layer, a first redistribution layer disposed on the first insulating layer, and a second insulating layer disposed on the first insulating layer and covering the first redistribution layer, the first redistribution layer is electrically connected to the connection pad, and when a thickness of the first redistribution layer is a, and a gap between patterns of the first redistribution layer is b, b/a is 4 or less. 本发明提供一种半导体封装件，所述半导体封装件包括：半导体芯片，具有连接垫；包封剂，覆盖所述半导体芯片的至少一部分；以及互连结构，设置在所述半导体芯片和所述包封剂上。所述互连结构包括第一绝缘层、设置在所述第一绝缘层上的第一重新分布层以及设置在所述第一绝缘层上并且覆盖所述第一重新分布层的第二绝缘层，所述第一重新分布层电连接到所述连接垫，当所述第一重新分布层的厚度为a且所述第一重新分布层的图案之间的间隙为b时，b/a为4或更小。