Laser processing apparatus, control method of laser processing apparatus, and control program thereof

• Main Author: OSHIMA EIJI
• Format: Patent
• Language: Chinese; English
• Published: 05.05.2020
• Subjects: CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS; OPTICS; PERFORMING OPERATIONS; PHYSICS; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

The invention provides a laser processing apparatus, a control method of the laser processing apparatus, and a control program of the laser processing apparatus. Laser alignment is easily performed byusing a simple structure. The laser processing apparatus includes: a processing table configured to process an object to be processed; a light irradiation unit that selects one of the visible laser light and the processing laser light to irradiate; and an adjustment unit that adjusts the position of the machining table on the basis of the irradiation position of the visible laser light irradiatedonto the machining table or the object to be machined, the light irradiation unit irradiating the laser light for machining onto the object to be machined disposed on the machining table adjusted bythe adjustment unit. 本发明提供一种利用简单的结构容易地进行激光的对位的激光加工装置、激光加工装置的控制方法以及激光加工装置的控制程序。激光加工装置具有：加工工作台，对加工对象物进行加工；光照射部，选择可见激光及加工用激光中的任一种激光进行照射；以及调整部，基于照射到加工工作台或加工对象物的可见激光的照射位置来调整加工工作台的位置，光照射部向在由调整部进行了调整的加工工作台上配置的加工对象物照射加工用激光。