POWER MODULE HAVING FEATURES FOR CLAMPING AND POWER MODULE ASSEMBLY

• Main Authors: PAULSEN LARS, BEER HOLGER
• Format: Patent
• Language: Chinese; English
• Published: 01.05.2020
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A power module (200) is disclosed. The power module (200) comprises: a base plate (210); an electronic component (230) mounted on a top surface of the base plate (210); and a body (220) encapsulatingthe electronic component (230) and the base plate (210). The body (220) is configured or designed such that a part of the top surface of the base plate (210) is externally accessible. A power module assembly comprising at least one power module (200) is also disclosed. The power module assembly further comprises: a substrate (400) on which the power module (200) is disposed; and at least one clamping device (300) configured for clamping on the part of the top surface of the base plate (210) and fixing the power module (200) to the substrate (400). 披露了一种功率模块(200)。该功率模块(200)包括：底板(210)；电子部件(230)，该电子部件安装在该底板(210)的顶表面上；以及主体(220)，该主体封装该电子部件(230)和该底板(210)。该主体(220)被配置或设计成使得该底板(210)的顶表面的一部分是从外部可触及的。还披露了一种包括至少一个功率模块(200)的功率模块组件。该功率模块组件进一步包括：基板(400)，该基板上设置有该功率模块(200)；以及至少一个夹持装置(300)，该夹持装置被配置用于在该底板(210)的顶表面的一部分上进行夹持，并且将该功率模块(