HEAT SINK SEGMENT, HEAT SINK AND METHOD FOR COOLING COMPONENTS

The invention relates to a heat sink segment for cooling components, in particular power electronics components, having a first segment surface and a second segment surface, the first segment surfaceand the second segment surface being oriented relative each other such that when a plurality of heat...

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Bibliographic Details
Main Authors WILLECK HANNES, RAMSAYER REINER, SCHOEPF MARTIN, RITTNER MARTIN, SEITZ BENJAMIN, BURGHARDT ANDREAS
Format Patent
LanguageChinese
English
Published 01.05.2020
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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