HEAT SINK SEGMENT, HEAT SINK AND METHOD FOR COOLING COMPONENTS

The invention relates to a heat sink segment for cooling components, in particular power electronics components, having a first segment surface and a second segment surface, the first segment surfaceand the second segment surface being oriented relative each other such that when a plurality of heat...

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Bibliographic Details
Main Authors WILLECK HANNES, RAMSAYER REINER, SCHOEPF MARTIN, RITTNER MARTIN, SEITZ BENJAMIN, BURGHARDT ANDREAS
Format Patent
LanguageChinese
English
Published 01.05.2020
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:The invention relates to a heat sink segment for cooling components, in particular power electronics components, having a first segment surface and a second segment surface, the first segment surfaceand the second segment surface being oriented relative each other such that when a plurality of heat sink segments is arranged concentrically all segment surfaces of the heat sink segments adjoin eachother. 本发明涉及一种用于冷却构件、特别是功率电子构件的冷却体分段，其带有第一分段面和第二分段面，其中，第一分段面和第二分段面这样彼此取向，使得在多个冷却体分段同心布置时，冷却体分段的所有的分段面彼此邻接。
Bibliography:Application Number: CN201880060958