ACOUSTIC WAVE DEVICE AND COMMUNICATION DEVICE

According to the present invention, a SAW device comprises: a mounting substrate which has a mounting surface; a SAW chip which is mounted on the mounting surface; a dummy chip which is mounted on themounting surface; and a resin part which covers the SAW chip and the dummy chip. The dummy chip comp...

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Bibliographic Details
Main Author ITO MOTOKI
Format Patent
LanguageChinese
English
Published 24.04.2020
Subjects
BASIC ELECTRIC ELEMENTS
BASIC ELECTRONIC CIRCUITRY
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS
RESONATORS
SEMICONDUCTOR DEVICES
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Summary:According to the present invention, a SAW device comprises: a mounting substrate which has a mounting surface; a SAW chip which is mounted on the mounting surface; a dummy chip which is mounted on themounting surface; and a resin part which covers the SAW chip and the dummy chip. The dummy chip comprises: an insulating dummy substrate; and one or more dummy terminals which are disposed on the mounting surface-side surface of the dummy substrate, and which are bonded to the mounting surface. The dummy chip constitutes an electrically open end when viewed from the mounting substrate side. SAW器件具有：具有安装面的安装基板；被安装于安装面的SAW芯片；被安装于安装面的虚设芯片；和将SAW芯片及虚设芯片覆盖的树脂部。虚设芯片具有：绝缘性的虚设基板；和位于虚设基板的安装面侧的表面上且与安装面接合的一个以上的虚设端子。在从安装基板侧电气地观察的情况下，虚设芯片构成开放端。
Bibliography:Application Number: CN201880058013